DRIS-3: Deep Neural Network Reliability Improvement Scheme in 3D Die-Stacked Memory based on Fault Analysis

Jae-San Kim, Joon-Sung Yang. DRIS-3: Deep Neural Network Reliability Improvement Scheme in 3D Die-Stacked Memory based on Fault Analysis. In Proceedings of the 56th Annual Design Automation Conference 2019, DAC 2019, Las Vegas, NV, USA, June 02-06, 2019. pages 129, ACM, 2019. [doi]

Abstract

Abstract is missing.