Isothermal aging characteristics of Sn-Pb micro solder bumps

K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H.-J. Chang, E. G. Chang. Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectronics Reliability, 43(5):757-763, 2003. [doi]

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