A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si - researchr publication authors

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Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Shinsuke Nakano, Hiroaki Katsurai, Takuro Fujii, Hidetaka Nishi, Takaaki Kakitsuka, Koichi Hasebe, Kota Shikama, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, Shinji Matsuo. A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si. In Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, CA, USA, March 11-15, 2018. pages 1-3, IEEE, 2018. [doi]

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