Development of high accuracy wafer thinning and pickup technology for thin wafer

Kosuke Kitaichi, Haruo Shimamoto, Chuichi Miyazaki, Yoshiyuki Abe, Sigeaki Saito, Shoji Yasunaga. Development of high accuracy wafer thinning and pickup technology for thin wafer. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

Abstract

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