Physical Design Automation for 3D Chip Stacks: Challenges and Solutions

Johann Knechtel, Jens Lienig. Physical Design Automation for 3D Chip Stacks: Challenges and Solutions. In Evangeline F. Y. Young, Mustafa Ozdal, editors, Proceedings of the 2016 on International Symposium on Physical Design, ISPD 2016, Santa Rosa, CA, USA, April 3-6, 2016. pages 3-10, ACM, 2016. [doi]

Abstract

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