John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte. 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. J. Solid-State Circuits, 41(8):1718-1725, 2006. [doi]
Abstract is missing.