Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, P. S. Chen, J.-H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
Abstract is missing.