Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Anelise Kologeski, Caroline Concatto, Debora Matos, Daniel Grehs, Tiago Motta, Felipe Almeida, Fernanda Lima Kastensmidt, Altamiro Amadeu Susin, Ricardo Reis. Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip. In 20th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2013, Abu Dhabi, December 8-11, 2013. pages 125-128, IEEE, 2013. [doi]

This author has not been identified. Look up 'Anelise Kologeski' in GoogleThis author has not been identified. Look up 'Caroline Concatto' in GoogleThis author has not been identified. Look up 'Debora Matos' in GoogleThis author has not been identified. Look up 'Daniel Grehs' in GoogleThis author has not been identified. Look up 'Tiago Motta' in GoogleThis author has not been identified. Look up 'Felipe Almeida' in GoogleThis author has not been identified. Look up 'Fernanda Lima Kastensmidt' in GoogleThis author has not been identified. Look up 'Altamiro Amadeu Susin' in GoogleThis author has not been identified. Look up 'Ricardo Reis' in Google

runs on WebDSL