Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip

Anelise Kologeski, Caroline Concatto, Debora Matos, Daniel Grehs, Tiago Motta, Felipe Almeida, Fernanda Lima Kastensmidt, Altamiro Amadeu Susin, Ricardo Reis. Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip. In 20th IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2013, Abu Dhabi, December 8-11, 2013. pages 125-128, IEEE, 2013. [doi]