3D super chip technology to achieve low-power and high-performance system-on-a chip

Mitsumasa Koyanagi. 3D super chip technology to achieve low-power and high-performance system-on-a chip. In Vojin G. Oklobdzija, Barry Pangle, Naehyuck Chang, Naresh R. Shanbhag, Chris H. Kim, editors, Proceedings of the 2010 International Symposium on Low Power Electronics and Design, 2010, Austin, Texas, USA, August 18-20, 2010. pages 61-62, ACM, 2011. [doi]

Abstract

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