Impact of Mechanical Stress on the Electrical Performance of 3D NAND

A. Kruv, A. Arreghini, M. Gonzalez, D. Verreck, G. Van den bosch, I. De Wolf, A. Furnemont. Impact of Mechanical Stress on the Electrical Performance of 3D NAND. In IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019. pages 1-5, IEEE, 2019. [doi]

Abstract

Abstract is missing.