Thermal-aware mobile SoC design and test in 14nm finfet technology

Bong Hyun Lee. Thermal-aware mobile SoC design and test in 14nm finfet technology. In 2014 International Test Conference, ITC 2014, Seattle, WA, USA, October 20-23, 2014. pages 1, IEEE, 2014. [doi]

Abstract

Abstract is missing.