Yu-Min Lee, Chun Chen, Jiaxing Song, Kuan-Te Pan. A TSV noise-aware 3-D placer. In Wolfgang Nebel, David Atienza, editors, Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, DATE 2015, Grenoble, France, March 9-13, 2015. pages 1653-1658, ACM, 2015. [doi]
Abstract is missing.