Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors

Ji-Heon Lee, Young Seo Lee, Jeong Hwan Choi, Hussam Amrouch, Joonho Kong, Young-Ho Gong, Sung Woo Chung. Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors. IEEE Access, 9:120715-120729, 2021. [doi]

Abstract

Abstract is missing.