Ahra Lee, SangChul Lee, Sungsik Lee, Chang Han Je, Sunghae Jung, Myoung-Lae Lee, Gunn Hwang, Byoung Gon Yu, Chang-Auck Choi. Chip scale packaging with surface mountable solder ball terminals for microsensors. In 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2009, Shenzhen, China, January 5-8, 2009. pages 612-615, IEEE, 2009. [doi]
Abstract is missing.