Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads

Jiayin Li, Meikang Qiu, Jianwei Niu, Laurence T. Yang, Yongxin Zhu, Zhong Ming. Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads. ACM Trans. Embedded Comput. Syst., 12(2):24, 2013. [doi]

@article{LiQNYZM13,
  title = {Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads},
  author = {Jiayin Li and Meikang Qiu and Jianwei Niu and Laurence T. Yang and Yongxin Zhu and Zhong Ming},
  year = {2013},
  doi = {10.1145/2423636.2423642},
  url = {http://doi.acm.org/10.1145/2423636.2423642},
  researchr = {https://researchr.org/publication/LiQNYZM13},
  cites = {0},
  citedby = {0},
  journal = {ACM Trans. Embedded Comput. Syst.},
  volume = {12},
  number = {2},
  pages = {24},
}