Using GA-SVM for defect inspection of flip chips based on vibration signals - researchr publication authors

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Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su. Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectronics Reliability, 81:159-166, 2018. [doi]

This author has not been identified. Look up 'Ke Li' in GoogleThis author has not been identified. Look up 'Lingyu Wang' in GoogleThis author has not been identified. Look up 'Jingjing Wu' in GoogleThis author has not been identified. Look up 'Qiuju Zhang' in GoogleThis author has not been identified. Look up 'Guanglan Liao' in GoogleThis author has not been identified. Look up 'Lei Su' in Google

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