Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su. Using GA-SVM for defect inspection of flip chips based on vibration signals. Microelectronics Reliability, 81:159-166, 2018. [doi]
@article{LiWWZLS18,
title = {Using GA-SVM for defect inspection of flip chips based on vibration signals},
author = {Ke Li and Lingyu Wang and Jingjing Wu and Qiuju Zhang and Guanglan Liao and Lei Su},
year = {2018},
doi = {10.1016/j.microrel.2017.12.032},
url = {https://doi.org/10.1016/j.microrel.2017.12.032},
researchr = {https://researchr.org/publication/LiWWZLS18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {81},
pages = {159-166},
}