A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging

Junhui Li, Haoliang Zhang, Can Zhou, Zhuo Chen, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu. A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging. IEEE Trans. Industrial Informatics, 15(7):3808-3820, 2019. [doi]

Abstract

Abstract is missing.