Lois Jinzhi Liao, Xi Zhang, Xiaomin Li, Younan Hua, Chao Fu, Weikok Tee, Boonhwa Yee, Bisheng Wang, Songlin Mao. Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination. In International Conference on IC Design and Technology, ICICDT 2019, Suzhou, China, June 17-19, 2019. pages 1-6, IEEE, 2019. [doi]
Abstract is missing.