Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process

Chun-fu Lin, Hong-Ren Fang, Jyh-Rou Sze, Sheng-Fuu Lin, Chi-Hung Hwang. Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process. In IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2016, Proceedings, Taipei, Taiwan, May 23-26, 2016. pages 1-6, IEEE, 2016. [doi]

Abstract

Abstract is missing.