Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen. Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.