Dong Liu, Wenyu Liang, Haiyue Zhu, Chek-Sing Teo, Kok Kiong Tan. Development of a distributed Bernoulli gripper for ultra-thin wafer handling. In IEEE International Conference on Advanced Intelligent Mechatronics, AIM 2017, Munich, Germany, July 3-7, 2017. pages 265-270, IEEE, 2017. [doi]
Abstract is missing.