Compact lateral thermal resistance modeling and characterization for TSV and TSV array

Zao Liu, Sahana Swarup, Sheldon X.-D. Tan. Compact lateral thermal resistance modeling and characterization for TSV and TSV array. In Jörg Henkel, editor, The IEEE/ACM International Conference on Computer-Aided Design, ICCAD'13, San Jose, CA, USA, November 18-21, 2013. pages 275-280, IEEE/ACM, 2013. [doi]

Abstract

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