Xiaodong Liu, Yifan Zhang, Gary K. Yeap, Xuan Zeng. An integrated algorithm for 3D-IC TSV assignment. In Leon Stok, Nikil D. Dutt, Soha Hassoun, editors, Proceedings of the 48th Design Automation Conference, DAC 2011, San Diego, California, USA, June 5-10, 2011. pages 652-657, ACM, 2011. [doi]
Abstract is missing.