Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology

Lukasz Lopacinski, Miroslav Marinkovic, Goran Panic, Mohamed Hussein Eissa, Alireza Hasani, Karthik KrishneGowda, Rolf Kraemer. Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology. IEEE Access, 7:44489-44502, 2019. [doi]

Abstract

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