Julia Hsin-Lin Lu, Wing-Fai Loke, Dimitrios Peroulis, Byunghoo Jung. Implementing wireless communication links in 3-D ICs utilizing wide-band on-chip meandering microbump antenna. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]
Abstract is missing.