Cezary Maj, Piotr Zajac, Michal Szermer, Andrzej Napieralski. The influence of residual stress induced by anodic wafer bonding on MEMS membrane properties. In Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems, MIXDES 2014, Lviv, Ukraine, June 19-21, 2014. pages 93-96, IEEE, 2014. [doi]
Abstract is missing.