3D stacking using ultra thin dies

Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, K. J. Rebibis, W. Zhang, Eric Beyne. 3D stacking using ultra thin dies. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-5, IEEE, 2011. [doi]

Abstract

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