Rayyan Manwar, Sazzadur Chowdhury. Characterization of adhesive wafer bonded CMUTs realized from BCB based sealed cavity. In IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montréal, QC, Canada, May 22-25, 2016. pages 2531-2534, IEEE, 2016. [doi]
Abstract is missing.