A structured and scalable test access architecture for TSV-based 3D stacked ICs - researchr publication authors

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Erik Jan Marinissen, Jouke Verbree, Mario H. Konijnenburg. A structured and scalable test access architecture for TSV-based 3D stacked ICs. In 28th IEEE VLSI Test Symposium, VTS 2010, April 19-22, 2010, Santa Cruz, California, USA. pages 269-274, IEEE Computer Society, 2010. [doi]

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