Hideya Matsuyama, Takashi Suzuki, Motoki Shiozu, Hideo Ehara, Takeshi Soeda, Hirokazu Hosoi, Masao Oshima, Kikuo Yamabe. Verification of Copper Stress Migration Under Low Temperature Long Time Stress. In IEEE International Reliability Physics Symposium, IRPS 2019, Monterey, CA, USA, March 31 - April 4, 2019. pages 1-5, IEEE, 2019. [doi]
Abstract is missing.