Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions - researchr publication

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M. Mirgkizoudi, C. Liu, P. P. Conway, S. Riches. Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions. Microelectronics Reliability, 55(6):952-960, 2015. [doi]

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