A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology

Daisuke Mizoguchi, Noriyuki Miura, Takayasu Sakurai, Tadahiro Kuroda. A 1.2 Gbps Non-contact 3D-Stacked Inter-Chip Data Communications Technology. IEICE Transactions, 89-C(3):320-326, 2006. [doi]

Abstract

Abstract is missing.