Thermally robust clocking schemes for 3D integrated circuits - researchr publication authors

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Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Tamer Ragheb, Greg M. Link, Narayanan Vijaykrishnan, Yehia Massoud. Thermally robust clocking schemes for 3D integrated circuits. In Rudy Lauwereins, Jan Madsen, editors, 2007 Design, Automation and Test in Europe Conference and Exposition (DATE 2007), April 16-20, 2007, Nice, France. pages 1206-1211, ACM, 2007. [doi]

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