Thermally robust clocking schemes for 3D integrated circuits

Mosin Mondal, Andrew J. Ricketts, Sami Kirolos, Tamer Ragheb, Greg M. Link, Narayanan Vijaykrishnan, Yehia Massoud. Thermally robust clocking schemes for 3D integrated circuits. In Rudy Lauwereins, Jan Madsen, editors, 2007 Design, Automation and Test in Europe Conference and Exposition (DATE 2007), April 16-20, 2007, Nice, France. pages 1206-1211, ACM, 2007. [doi]

@inproceedings{MondalRKRLVM07:0,
  title = {Thermally robust clocking schemes for 3D integrated circuits},
  author = {Mosin Mondal and Andrew J. Ricketts and Sami Kirolos and Tamer Ragheb and Greg M. Link and Narayanan Vijaykrishnan and Yehia Massoud},
  year = {2007},
  doi = {10.1145/1266366.1266626},
  url = {http://doi.acm.org/10.1145/1266366.1266626},
  researchr = {https://researchr.org/publication/MondalRKRLVM07%3A0},
  cites = {0},
  citedby = {0},
  pages = {1206-1211},
  booktitle = {2007 Design, Automation and Test in Europe Conference and Exposition (DATE 2007), April 16-20, 2007, Nice, France},
  editor = {Rudy Lauwereins and Jan Madsen},
  publisher = {ACM},
  isbn = {978-3-9810801-2-4},
}