Low temperature direct bonding: An attractive technique for heterostructures build-up

H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, L. Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet. Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectronics Reliability, 52(2):331-341, 2012. [doi]

Abstract

Abstract is missing.