Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto. Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. Microelectronics Reliability, 46(5-6):923-929, 2006. [doi]

Authors

Yasuyuki Morita

This author has not been identified. Look up 'Yasuyuki Morita' in Google

Kazuo Arakawa

This author has not been identified. Look up 'Kazuo Arakawa' in Google

Mitsugu Todo

This author has not been identified. Look up 'Mitsugu Todo' in Google

Masayuki Kaneto

This author has not been identified. Look up 'Masayuki Kaneto' in Google