Introducing redundant TSV with low inductance for 3-D IC

Siraj Fulum Mossa, Syed Rafay Hasan, Omar Sayed Ahmed Elkeelany. Introducing redundant TSV with low inductance for 3-D IC. In IEEE 12th International New Circuits and Systems Conference, NEWCAS 2014, Trois-Rivieres, QC, Canada, June 22-25, 2014. pages 117-120, IEEE, 2014. [doi]

Abstract

Abstract is missing.