V. Nair, L. Krishnamurthy, J. Swan, A. Essaian, T. Frank, M. Bynum. 3D stacked embedded component system-in-package for wearable electronic devices. In 2017 IEEE Radio and Wireless Symposium, RWS 2017, Phoenix, AZ, USA, January 15-18, 2017. pages 108-110, IEEE, 2017. [doi]
Abstract is missing.