Giorgio Di Natale, Marie-Lise Flottes, Bruno Rouzeyre, Hakim Zimouche. Built-in self-test for manufacturing TSV defects before bonding. In IEEE 32nd VLSI Test Symposium, VTS 2014, Napa, CA, USA, April 13-17, 2014. pages 1-6, IEEE, 2014. [doi]
Abstract is missing.