Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package - researchr publication

researchr

You are not signed in
Sign in
Sign up

Ghanshyam Nayak, P. R. Mukund. Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package. In 17th International Conference on VLSI Design (VLSI Design 2004), with the 3rd International Conference on Embedded Systems Design, 5-9 January 2004, Mumbai, India. pages 627-630, IEEE Computer Society, 2004. [doi]

Abstract is missing.

runs on WebDSL