Challenges and opportunities in integration of 2D materials on 3D substrates: Materials and device perspectives

Mahesh R. Neupane, Dmitry Ruzmetov, Robert Burke, A. Glen Birdwell, Decarlos Taylor, Matthew Chin, Terrance O'Regan, Frank Crowne, Barbara Nichols, Pankaj Shah, Edward Byrd, Tony Ivanov. Challenges and opportunities in integration of 2D materials on 3D substrates: Materials and device perspectives. In 76th Device Research Conference, DRC 2018, Santa Barbara, CA, USA, June 24-27, 2018. pages 1-2, IEEE, 2018. [doi]

Abstract

Abstract is missing.