A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology

Tianming Ni, Zhao Yang, Hao Chang, Xiaoqiang Zhang, Lin Lu, Aibin Yan, Zhengfeng Huang, Xiaoqing Wen. A Novel TDMA-Based Fault Tolerance Technique for the TSVs in 3D-ICs Using Honeycomb Topology. IEEE Trans. Emerging Topics Comput., 9(2):724-734, 2021. [doi]

Abstract

Abstract is missing.