Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

M. Niedermayer, Stephan Guttowski, R. Thomasius, D. Polityko, K. Schrank, Herbert Reichl. Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. In John A. Stankovic, Phillip B. Gibbons, Stephen B. Wicker, Joseph A. Paradiso, editors, Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, IPSN 2006, Nashville, Tennessee, USA, April 19-21, 2006. pages 391-398, ACM, 2006. [doi]

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