Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration

Kiichi Niitsu, Yoshinori Kohama, Yasufumi Sugimori, Kazutaka Kasuga, Kenichi Osada, Naohiko Irie, Hiroki Ishikuro, Tadahiro Kuroda. Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration. IEEE Trans. VLSI Syst., 18(8):1238-1243, 2010. [doi]

Abstract

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