Inter-Batch Gap Filling Using Compressive Sampling for Low-Cost IoT Vibration Sensors

Boon-Yaik Ooi, Soung-Yue Liew, Woan Lin Beh, Shervin Shirmohammadi. Inter-Batch Gap Filling Using Compressive Sampling for Low-Cost IoT Vibration Sensors. In IEEE International Instrumentation and Measurement Technology Conference, I2MTC 2021, Glasgow, United Kingdom, May 17-20, 2021. pages 1-6, IEEE, 2021. [doi]

Abstract

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