Jin Ouyang, Guangyu Sun, Yibo Chen, Lian Duan, Tao Zhang, Yuan Xie, Mary Jane Irwin. Arithmetic unit design using 180nm TSV-based 3D stacking technology. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]
Abstract is missing.