Ambient temperature and layout impact on self-heating characterization in FinFET devices

Peter C. Paliwoda, Zakariae Chbili, A. Kerber, D. Singh, D. Misra. Ambient temperature and layout impact on self-heating characterization in FinFET devices. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 6, IEEE, 2018. [doi]

Abstract

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