Dongfang Pan, Guolong Li, Fangting Miao, Biao Deng, Junying Wei, Daquan Yu, Ming Liu, Lin Cheng. A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density. In IEEE International Solid-State Circuits Conference, ISSCC 2021, San Francisco, CA, USA, February 13-22, 2021. pages 468-470, IEEE, 2021. [doi]
Abstract is missing.